SMT solder paste centrifugal mixing and degassing machine

OK-QC500 Solder Paste Aging Inspection Tester

The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.

Key Features

• Viscosity Test: Measures paste viscosity after rewarming against manufacturer specifications to verify proper flow characteristics for stencil printing
• Slump Test: Evaluates paste shape retention after printing — cold or over-aged paste that spreads laterally will be detected before causing bridging defects
• Tack Test: Quantifies paste tackiness to ensure adequate component hold force during placement and transport before reflow
• Solder Ball Test: Identifies paste degradation by checking for excessive solder ball formation during reflow — a key indicator of expired or improperly stored paste
• IPC-TM-650 and JIS Z 3284 Compliant: Test protocols aligned with international industry standards for auditable quality records

Applications

Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.

Packaging and Shipping

Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.